My CV

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Dr Aboubacar Chaehoi
Senior Technical Leader — MEMS & Semiconductor Sensor Specialist

PROFESSIONAL SUMMARY

Senior Technical Leader and Ph.D. with 20+ years of comprehensive expertise in MEMS sensors, semiconductor design, and microsystem integration for automotive and high-reliability industrial applications. Track record leading cross-functional R&D teams from initial sensor concept and multiphysics modeling through cleanroom fabrication, component PPAP qualification, and high-volume mass production. Led advanced engineering in automotive inertial (accelerometers, gyroscopes), pressure and magnetic (Hall-effect) sensors, with international patents and multiple papers and oral presentations in major international IEEE conferences and journals.


CORE COMPETENCIES & TECHNICAL SKILLS
MEMS & Sensors: Hall-Effect Magnetic Sensors, Accelerometers, Gyroscopes, Pressure Sensors
Processes & Packaging: CMOS-SOI Integration, Monolithic Integration, Wafer-Level Packaging (BCB, Anodic Bonding)
Automotive & Quality:

AEC-Q100, PPAP, Component Qualification, Reliability Assessment, ISO 26262, Functional Safety and Automotive SPICE, Customer Interface

CAD, FEM & Simulation:

Synopsys, Cadence (Analog Artist, Virtuoso), ANSYS (Multiphysics, FEM), COMSOL, CoventorWare, MATLAB, Python

Management & R&D:

Technical Leadership, Project Management, European/National Grant Proposal Authoring, Patent Strategy


PROFESSIONAL EXPERIENCE
2019-Now Technical Leader – Automotive Magnetic Sensors TDK-Micronas, Freiburg, Deutschland (www.micronas.tdk.com )
  TDK-Micronas is a  globally  operating  manufacturer  of  semiconductors which develops and produces trend-setting IC and sensor system solutions for automotive and industrial electronics.
 
  • Technical Project Ownership: Led technical development of Hall-effect magnetic field sensor ICs and sensor system solutions for Tier-1 automotive and industrial electronic applications.
  • Product Lifecycle & Qualification: Designed, executed, and reported comprehensive product characterization, evaluation, and support AEC-Q100 qualification plans from wafer level to finished package, approved of qualification data and production start.
  • Functional Safety: Partnered with FuSa Manager to support FMEA and safety analysis.
  • Cross-Functional Leadership: Directed multidisciplinary engineering tasks across IC design and test engineering teams.
  • Customer - R&D Interface: Acted as primary technical authority and point of contact for automotive key account customers, translating OEM requirements into technical specifications.
  •  Management Reporting: Partnered with Product Manager to swiftly resolve technical roadblocks and maintain product quality and delivery time. Monthly reported to top management (CEO and VPs) on the technical issues which could impact timing, budget as well as product portfolio.



2015-2018 Senior Sensor Engineer – Project Leader , ZF-TRW, Radolfzell, Deutschland (www.zf.com )
  ZF-TRW - one of the largest automotive suppliers worldwide - is a global leader in electronics and sensors for automotive active and passive safety technology. My responsibilities include:
 
  • Specification and Requirements Management: Authored MEMS sensor component specifications and qualification matrices (accelerometers, gyroscopes, pressure sensors) for active/passive safety systems.
  •  Production Launch & PPAP: Managed development milestones, prototype characterization, and component PPAP deliverables, ensuring seamless ramp-up to high-volume automotive production.
  • Procurement Operations and Strategic Sourcing: Partnered with Commodity Manager to author RFQs for sensor components. Analyzed MEMS supplier proposals and evaluated performance capabilities. Supported strategic supplier selection and market awarding for key projects.
  • Supplier & Quality Management: Led technical interface with global MEMS foundries/suppliers; supported product development at the supplier and conducted design and process reviews. Partnered with ZF Quality to resolve technical sensor deviations and audits.
 


2013-2014 Technical Project Manager , CEA-Leti, Grenoble, France (www-leti.cea.fr/en )
  Leti is a department of CEA, a research and technology organization with activities in energy, IT, healthcare, defense and security. It specializes in nanotechnologies and their applications. My responsibilities include:
 
  • Breakthrough R&D Management: Managed end-to-end development of high-performance accelerometers utilizing innovative micro- and nano-electromechanical systems (M&NEMS®) technology (tasks planning and control, risk assessment and technical deliverables management, customer relationship management).
  • MEMS Design: Designed of an innovative patented MEMS accelerometer.
  • Fabrication & Cleanroom Coordination: Coordinated cross-departmental teams covering mask design and lithography.
  • Intellectual Property: Co-inventor on patent US10371711B2: “Damped Linear Accelerometer”.
 


2012  Inertial Sensor Expert , Exail-IXBLUE, Lannion, France ( www.exail.com )
  Exail-IXBLUE is a Global Solution Provider delivering Inertial, Motion, Subsea Acoustic, Seabed Mapping and Sub Bottom Profiling Products and Systems. My responsibilities include:
 
  • FEM Multiphysics Modeling: Developed comprehensive finite element models (ANSYS) simulating thermo-mechanical packaging stresses and read-out electronic effects on quartz-based inertial accelerometers.
  • Industrialization Readiness: Optimized mechanical and thermal sensor behavior, successfully driving development to final industrialization readiness.
 


2006–2012 Senior MEMS Designer – Project Leader,  Institute for System Level Integration, Edinburgh, UK, (www.isli.co.uk ).
  ISLI is an R&D and technology transfer service company that supports the development of electronics systems and MEMS and explores new technologies through research. My responsibilities include:
 
  • Monolithic Integration: Designed monolithic 3-axis piezoresistive accelerometers and pressure sensors on a dedicated CMOS-SOI process in partnership with Semefab foundry.
  • Packaging & Reliability: Implemented complete wafer-level packaging solutions (BCB and anodic bonding), failure analysis protocols, and electrical characterization.
  • Grants & Consortium partnership: Authored UK and European research grant proposals, building collaborative industrial consortia and securing project funding (Scottish Consortium in Integrated Micro-Photonic Systems (SCIMPS)
  • Mentorship & Academia: Supervised MSc/PhD research theses in MEMS sensor design (“Development and Design of an integrated Gimbal Gyroscope”, “Design of low-power hotplate for MEMS capacitive humidity sensors” and “Sigma-Delta modulator conditioning system for Pellistor-type Gas Sensors”).

    Served as guest lecturer in Mechanical Engineering at Heriot-Watt University.



 2002-2005 Doctoral – Applied Researcher , Laboratoire d’Informatique et de Microélectronique de Montpellier (LIRMM), France and University of Catania, Italy
 
  • Designed and fabricated CMOS-FSBM 3-axis accelerometers using piezoresistive and thermal transduction.
  • Teaching and mentoring experience: Labs on Pspice simulation; Labs on C language; student project advisor “Active damping of resonant accelerometers using electromagnetic forces”, “Test of monolithic MEMS”.
  • Authored multiple peer-reviewed papers in IEEE-sponsored international conferences and journals.


2002 Intern Researcher , Laboratoire d’Informatique et de Microélectronique de Montpellier (LIRMM), France

  • Created innovative oscillation-based test methods for monolithic MEMS (Cadence, Analog Artist, Monte Carlo simulations, AHDL language).


2001 Research Assistant , Institut d'Electronique du Sud - MITEA research group (CEM2), Montpellier, France

  • Developed an electronic readout circuit and performance evaluation of a thermopile and a vacuum sensor.



  EDUCATION
2002-2005 PhD Microelectronics/MEMS , Université de Montpellier - France & Universtà Degli Studi di Catania - Italy
2001-2002 Postgraduate degree (M.Res / DEA, Hons)  Microelectronics, University of Montpellier
2000-2001 MSc  Electronics Engineering, University of Montpellier
   
  PATENTS & PUBLICATIONS
Patents: US Patent US10371711B2 - "Damped Linear Accelerometer" (Co-inventor)
EU Patent EP3217181B1 - "Accéléromètre linéaire amorti(Co-inventor)
Publications:  

Author of multiple papers in IEEE conferences & journals (chaehoi.com/Publications)

Technical translator of "Nanotechnologies(M.Wautelet, IET 2009, 0863419416).


  LANGUAGES
  • French:  Native
  • English: Full Professional / Fluent
  • German: Conversational (B2)

  ACTIVITIES & INTERESTS
  • Sport : mountain biking and kickboxing / K1 / MuayThai boxing
  • Photography : nature, portrait, cosplay